ROLE PURPOSE:工作描述:Interface and facilitate engineering engagement, technical representation with potential new customers for new package and device qualification.Understand the customer specifications and verify the Assembly Process capability to ensure finish product complies as per customer requirement.Define members of a cross functional team from Process Engineering, Production, Quality Assurance and NPI Team to ensure smooth transfer from design conceptualization, prototyping, qualification builds, pre-production to full HVM.Collaborate with Design team for new device, package and perform Technical Risk Assessment to work a mitigation plan with Process Engineering and NPI Engineering team.Provide immediate assistance to any technical information as required by customers thru their inquiries.Drive and manage NPI engineering ****uation, qualification to meet project timeline in coordination with cross functional teams.Responsible to track daily status of customer projects and key issues.Ensure constant feedback on project milestones thru regular conference calls and/or face to face meetings with customers.工作描述:? 與潛在的新客戶進(jìn)行交流并促進(jìn)工程參與和技術(shù)代表，以進(jìn)行新封裝和設(shè)備認(rèn)證。? 了解客戶規(guī)格并驗(yàn)證裝配工藝能力，以確保成品符合客戶要求。? 從工藝工程、生產(chǎn)、質(zhì)量保證和NPI團(tuán)隊(duì)中定義跨職能團(tuán)隊(duì)的成員，以確保從設(shè)計(jì)概念化、原型設(shè)計(jì)、資格認(rèn)證構(gòu)建、預(yù)生產(chǎn)到完整HVM的順利過渡。? 與設(shè)計(jì)團(tuán)隊(duì)合作開發(fā)新設(shè)備、封裝并執(zhí)行技術(shù)風(fēng)險(xiǎn)評估，以與工藝工程和 NPI 工程團(tuán)隊(duì)合作制定緩解計(jì)劃。? 根據(jù)客戶的詢問，對客戶所需的任何技術(shù)信息提供即時(shí)幫助。? 與跨職能團(tuán)隊(duì)協(xié)調(diào)，推動(dòng)和管理 NPI 工程評估、資格認(rèn)證以滿足項(xiàng)目時(shí)間表。? 負(fù)責(zé)跟蹤客戶項(xiàng)目的日常狀態(tài)和關(guān)鍵問題。? 通過定期電話會(huì)議和/或與客戶面對面的會(huì)議，確保對項(xiàng)目節(jié)點(diǎn)的持續(xù)反饋。 KEY TASKS & RESPONSIBILITIES:工作職責(zé):Technical skills and knowledge on assembly packaging.Lead project for New Product Introduction.Review the new device, package design of customer’s enquiries.Plan and organize assembly ****uation for New Product IntroductionPrepare presentation material and compiled technical assembly report for the project.New Project execution thru APQP methodology and update/upload in eNPI system. 主要任務(wù)和職責(zé)：工作職責(zé):? 裝配封裝方面的技術(shù)技能和知識。? 領(lǐng)導(dǎo)新產(chǎn)品導(dǎo)入項(xiàng)目。? 審查新設(shè)備、包裝設(shè)計(jì)的客戶咨詢。? 計(jì)劃并組織新產(chǎn)品導(dǎo)入的裝配評估。? 為項(xiàng)目準(zhǔn)備演示材料和編制技術(shù)組裝報(bào)告。? 通過APQP方法執(zhí)行新項(xiàng)目，并在eNPI系統(tǒng)中更新/上傳。 JOB REQUIREMENTS:任職資格:Bachelor’s Degree in Electronics, Electrical, Mechanical Engineering or related engineering discipline.Over 5 years working experience in related processes in high volume electronics manufacturing environment preferably semiconductor.Knowledge in APQP, DOE, SPC, FMEA and MSA.Apply full understanding of engineering principles in performing job responsibility.Good command in both spoken and written in English and Chinese / Mandarin.Knowledge in Microsoft Office.Able to work with cross functional team and with minimum supervision.Effective interpersonal and communication skills.任職要求：任職資格:? 電子、電氣、機(jī)械工程或相關(guān)工程學(xué)科的學(xué)士學(xué)位。? 5年以上大批量電子制造環(huán)境相關(guān)工藝工作經(jīng)驗(yàn)，最好是半導(dǎo)體。? 了解APQP、DOE、SPC、FMEA和MSA。? 在履行工作職責(zé)時(shí)充分理解工程原理。? 良好的中英文/普通話口語和寫作能力。? 了解 Microsoft Office。? 能夠與跨職能團(tuán)隊(duì)合作，具有工作自主性。? 有效的人際關(guān)系和溝通技巧。

As a independent group of companies offering test & assembly services for a broad range of integrated circuits including memory, mixed-signal, analog, logic and memory. 聯(lián)測優(yōu)特作為半導(dǎo)體封裝測試行業(yè)全球排名前列的企業(yè),UTAC集團(tuán)在集成電路，模擬混合信號，邏輯無線電頻率集成電路IC等相關(guān)業(yè)務(wù)范圍內(nèi)占有其獨(dú)立的一席之地。 UTAC Yantai offers a full range of package and test development, engineering and manufacturing services and solutions to a worldwide customer base, comprising integrated device manufacturers (IDMs), fabless companies and wafer foundries. 公司提供種類齊全的封裝測試研發(fā)，為客戶提供生產(chǎn)制造的相關(guān)服務(wù)及解決方案，其全球范圍內(nèi)的客戶包括完善的設(shè)備制造廠，無生產(chǎn)線的公司以及硅片鑄造廠等等。